Explanation/Annotation:Temperature-resistant hermetic, cold curing.
Detailed model description:Chemical nature, main characteristics and attributes.
glue on the basis of ýïîêñèêðåìíèéîðãàíè÷åñêîé resin, amine hardener
and fine-dispersed filler (pap of ñâåòëî-êðåìîâîãî
colour with reduced by the viscosity).
viability in case of 20-25 degree. With no less than - 2÷.
optimal solidification behavior in case of 20-25 degree. With - 48÷, accelerated
solidification behaviors: 80 degree. With - 4÷, or 150 degree. With - 3÷.
production characteristics, at shift on specimens from TOP TOR steel
30ÕÃÑÀ. MPa (êãñ/êâ. cm), no less than
- in case of 20 degree. S. 16. 0 (160);
- in case of 200 degree. S. 1. 5 - 2. 0 (15. 0 - 20. 0).
operating temperature range:
from - 269 to +200 degree. With;
breakdown point of 20-22êV/ìì.
the glue is resistant to water action and dissolvents.
application direction (appointment).
for steels gluing, aluminium, copper, brass, ceramic, sitall,
graphite, ôòîðî-ïàñòà. Is perspective for usage in electronic and
laser engineering, when manufacturing the integrated microcircuits, in glue
compound of, exploited space-ambient. |
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