Explanation/Annotation:For bodies of lead frames of semiconductor devices and microcircuits, d
ýëåêòðîñîåäèíèòåëåé hoists, electrovacuum instruments etc..
Detailed model description:Total and layer-by-layer ribbon dimensions:
depth: 015. 05 MM; width: 10. 110 MM; depth of continuous compensations -
0005-005 MM; depth metals cladding: 0005. 001 MM; width ïëàê
èðóþùèõ pages: 3. 15 MM.
on inquiries of consumer can be been developed and implemented in ïðîèçâîäñò
in other dimension-types cladding bands within limits of mentioned ãàáà
ðèòíûõ amounts. |
