Explanation/Annotation:Temperature-resistant, hermetic, cold curing.
Detailed model description:Chemical nature, main characteristics and attributes.
glue on the basis of ýïîêñèêðåìíèéîðãàíè÷åñêîé resin, hardener and
filling agent ( òðåõóïàêîâî÷íûé composition, pap).
optimal solidification behavior in case of 20-25 degree. With - 48÷, accelerated
solidification behaviors: 80 degree. With - 4÷, or 150 degree. With - 3÷.
on specimens from TOP TOR steel of 30ÕÃÑÀ shear strength, MPa
( êãñ/êâ. cm), no less than, in case of 20 degree. With 16. 0 (160).
operating temperature range: from - 60 to +200 degree. S.
application direction (appointment).
for gluing of glass and metall shells
electron-beam devices, providing the vacuum to ~10^-6 MM
Hg column. designs steely, aluminium, brass, glass, ceramic and
glass-textolites .
is being applied as a low-temperature putty for elimination
vacuum leaks (instead of brazing), for micropores closing in welded joints
copperwares. |
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